1. 2. 3. material content data sheet sales product name ika08n65h5 issued 29. august 2013 ma# MA001030830 package pg-to220-3-111 weight* 2239.24 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 0.784 0.04 0.04 350 350 leadframe non noble metal iron 7439-89-6 0.687 0.03 307 inorganic material phosphorus 7723-14-0 0.206 0.01 92 non noble metal copper 7440-50-8 686.221 30.65 30.69 306454 306853 wire non noble metal aluminium 7429-90-5 2.282 0.10 0.10 1019 1019 encapsulation organic material carbon black 1333-86-4 2.214 0.10 989 plastics epoxy resin - 208.161 9.30 92961 inorganic material silicondioxide 60676-86-0 896.862 40.04 49.44 400521 494472 leadfinish non noble metal tin 7440-31-5 7.942 0.35 0.35 3547 3547 plating non noble metal nickel 7440-02-0 0.305 0.01 136 inorganic material phosphorus 7723-14-0 0.001 0.00 0.01 1 136 solder non noble metal antimony 7440-36-0 0.090 0.00 40 noble metal silver 7440-22-4 0.224 0.01 100 non noble metal tin 7440-31-5 0.582 0.03 0.04 260 400 heatspreader inorganic material phosphorus 7723-14-0 0.130 0.01 58 non noble metal iron 7439-89-6 0.433 0.02 193 non noble metal copper 7440-50-8 432.110 19.30 19.33 192972 193223 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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